Chips
Qualcomm’s New Snapdragon Chip Is Built for the Agentic AI Phone
Qualcomm is launching two versions, including an “Extreme” variant aimed at higher-performance devices.
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Qualcomm is launching two versions, including an “Extreme” variant aimed at higher-performance devices.
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The chip was taped out on January 26, 2026, and achieved first-pass silicon success on August 15.
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The facility is expected to focus on silicon ingot production and processing for advanced semiconductor technologies and leading-edge nodes.
Indian IT
TCS said the offering brings together semiconductor engineering, VLSI design, hardware-software co-design and system-level validation capabilities.
Partnerships
d-Matrix will integrate Raptor with NVIDIA’s latest rack architecture, which includes Vera CPUs, NVLink switches, BlueField-4 DPUs, ConnectX-9 SuperNICs and Spectrum-X Ethernet networking.
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Built using a 2-nanometer process, the chip will feature 11 high-performance cores running at up to 5.7 GHz, along with an on-chip data processing unit for input/output operations.
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The company formally began the A2000 program in 2023, although its foundational work on silicon IP and AI-focused chip architecture started several years earlier.
Funding
BigEndian is also strengthening partnerships in Taiwan to support manufacturing and supply chain integration.
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The effort remains in early stages, and the company has not yet committed to building custom chips or assembling a dedicated team.
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The compute resources will be used to train and deploy Anthropic’s flagship Claude AI models.
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The chip will be manufactured by TSMC using its advanced 3-nanometer process.
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The card enables full AI workloads to run on its onboard MLSoC architecture, reducing reliance on host CPUs and improving throughput.