Texas Instruments Unveils New Lithography Device for Advanced Chip Packaging

Texas Instruments (TI) has unveiled the DLP991UUV digital micromirror device (DMD), its most advanced direct imaging solution to date, designed to push the boundaries of digital lithography for advanced semiconductor packaging.

The new device features 8.9 million pixels, sub-micron resolution, and processing speeds of up to 110 gigapixels per second, enabling manufacturers to achieve high-precision, maskless lithography at scale. By removing the need for costly photomasks, the technology improves flexibility, reduces production costs, and boosts throughput and yield.

Advanced packaging—key to powering high-performance applications such as AI, data centers, and 5G—relies on combining multiple chips into compact, power-efficient systems. TI’s DLP991UUV acts as a programmable photomask, offering precise pixel control and real-time correction for increasingly complex designs.

“Just as we redefined cinema by enabling the transition from film to digital projection, TI’s DLP technology is once again at the forefront of a major industry shift,” said Jeff Marsh, vice president and general manager of DLP technology at TI. “We're enabling the creation of maskless digital lithography systems that empower engineers around the world to breakthrough the current limits of advanced packaging and bring powerful computing solutions to market.”

The DLP991UUV is now available in preproduction quantities on TI.com. The device leads TI’s lithography portfolio with the smallest mirror pitch (5.4 µm), high power levels, and compatibility with wavelengths as low as 343 nm, making it a powerful tool for next-generation chip manufacturing.