MediaTek to Tape Out First 2nm Chip at TSMC in September 2025
Recently, MediaTek also introduced Dimensity 9400e, its latest flagship chipset built on TSMC’s third-gen 4nm process
Taiwanese chipmaker MediaTek announced plans to tape out its first 2-nanometer chip at Taiwan Semiconductor Manufacturing Company (TSMC) in September 2025.
CEO Rick Tsai shared this milestone during his keynote at Computex 2025 in Taipei, highlighting the company's commitment to advancing semiconductor technology.
The upcoming 2nm chip is expected to deliver a 15% performance boost and 25% improved power efficiency over its 3nm predecessor, the Dimensity 9400.
Recently, MediaTek also introduced all-big-core the Dimensity 9400e, its latest flagship chipset built on TSMC’s third-gen 4nm process.
Featuring an all-big-core CPU with four Cortex-X4 cores (up to 3.4GHz) and four Cortex-A720 cores (2.0GHz), it delivers top-tier performance and energy efficiency.
The chipset boasts a 12-core Immortalis-G720 GPU with hardware-based ray tracing for immersive gaming.
It also includes MediaTek HyperEngine, MAGT 2.0 for adaptive performance scheduling, and MFRC 2.0+ for up to 40% power savings.
With advanced AI, connectivity, and imaging support, the 9400e enhances gaming and multitasking on flagship smartphones.
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